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Elecfoil Korea's sole manufacturer
of copper foils for PCBs PCB foil, a crucial component in electronic devices such as TVs, computers, and smartphones, is a copper foil integral to PCBs. This copper is extracted through an electrolytic process from a CuSO4 solution, where it undergoes sophisticated refinement.
LOTTE ENERGY MATERIALS has pioneered the development and market introduction of high-performance specialty PCB foils in Korea, catering to the industry's trend towards smaller and more complex devices.
Our innovation and early market entry have secured us the leading global market share in this advanced material sector. PCB foil, a crucial component in electronic devices such as TVs, computers, and smartphones, is a copper foil integral to PCBs. This copper is extracted through an electrolytic process from a CuSO4 solution, where it undergoes sophisticated refinement.
LOTTE ENERGY MATERIALS has pioneered the development and market introduction of high-performance specialty PCB foils in Korea, catering to the industry's trend towards smaller and more complex devices.
Our innovation and early market entry have secured us the leading global market share in this advanced material sector.
Specification
  • Ultra-thin copper foil 1㎛
    Production of ultra-thin copper foils for PKG(1~3㎛)
  • Copper foils for PCB 7㎛
    Production of the thinnest copper foils (7㎛) for PCB
  • Very low profile 0.5㎛
    Production of 0.5㎛ electrolytic copper foil with very low surface roughness for high-speed signal transmission
    Reduction of transmission loss by minimizing skin effect
  • Total PCB Products
    Establishment of product lineup for various PCB applications
    Capable of responding to customer demands
Product
ICS
Product Features

High-quality PCB foil optimized for general Multilayer Rigid PCBs

Adhesive strength Stable adhesion strength to various boards
Etching Stable circuit etching properties that enable various line widths to be implemented
Thickness 8 ~ 35㎛
Property table *12㎛ standard tensile strength & elongation
Classification ICS
Room temperature Tensile strength kgf/㎟ ≥ 35
Elongation % > 3
Adhesive strength @FR-4 kgf/㎝ ≥ 0.8
Corresponding surface roughness ㎛ ≤ 4.0
Corresponding thickness ㎛ 8, 9, 12, 18, 35
IHT / ICR / IRT
Product Features

Copper foil designed for superior adhesion to PI, offering excellent bending resistance without compromising on low surface roughness for flexible PCB applications

MIT Stable bending resistance can be secured
High heat resistance Copper foil that does not deform even at high processing temperatures
Thickness 7 ~ 35㎛
Property table *12㎛ standard tensile strength & elongation
Classification IHT ICR IRT
Room temperature Tensile strength kgf/㎟ ≥ 25 ≥ 35 ≥ 40
Elongation % > 6 > 3 > 3
Corresponding surface roughness ㎛ ≤ 2.0 ≤ 2.5 ≤ 2.0
Corresponding thickness ㎛ 7~12 7~70 7~70
HRT / MRT / SRT
Product Features

RTF(Reverse Treated Foil) product with excellent high-frequency properties up to ~10Ghz, featuring high adhesive strength with low-dielectric materials

Surface profile Rz ≤ 1.8, low surface profile
Adhesive strength P/S >0.5, @18㎛
Thickness 12 ~ 70㎛
Property table *18㎛ standard tensile strength & elongation
Classification HRT MRT SRT
Grade RTF 1 RTF 2 RTF 3
Room temperature Tensile strength kgf/㎟ ≥ 35 ≥ 35 ≥ 35
Elongation % > 3 > 3 > 3
Corresponding surface roughness ㎛ ≤ 1.8 ≤ 1.5 ≤ 1.5
Corresponding thickness ㎛ 7~70
IVP / ISP / LHZ / LSZ / New Product
Product Features

This product is designed for high-speed signal transmission in ultra-low light conditions, exhibiting low transmission loss in high-frequency environments. It is suitable for use as an inner layer in high-performance products such as servers, routers, and switches. It features stable adhesion characteristics with low Dk, Df resins and has low loss properties. The ultra-low roughness surface treatment with Rz 0.5 or less ensures excellent performance even in frequency bands up to 50GHz. HVLP provides stable adhesion between the resin and Elecfoil, and the ultra-fine nodule treatment maximizes ultra-high-speed signal transmission characteristics. Thanks to these features, HVLP copper foil has established itself as an essential material for high-speed signal transmission in applications such as 6G and AI.

Surface profile Low surface profile and fine nodule size
Adhesive strength P/S >0.4, @18㎛
Thickness 12 ~ 35㎛
Property table *18㎛ standard tensile strength & elongation
Classification IVP ISP LHZ LSZ New
Product
Grade HVLP 1 HVLP 2 HVLP 3 HVLP 4 HVLP 5
Room temperature Tensile strength kgf/㎟ ≥ 45 ≥ 45 ≥ 35 ≥ 35 Under development
Elongation % > 3 > 3 > 3 > 3
Corresponding surface roughness ㎛ ≤ 1.5 ≤ 1.2 ≤ 1.0 ≤ 0.8 ≤ 0.5
Corresponding thickness ㎛ 12~35
LPF / LPS
Product Features

High-performance copper foil with exceptional mechanical strength, facilitating the creation of Fine Pattern during circuit etching, making it an ideal material for Package Substrates. Maintains high adhesive strength despite low surface roughness, suitable for use in HDI(High Density Interconnection) applications.
The product is differentiated by high-temperature elongation rate.

Surface profile Rz ≤ 2.0, low surface profile
Adhesive strength P/S >0.7, @12㎛
Thickness 7 ~ 12㎛
Property table *12㎛ standard tensile strength & elongation
Classification LPF LPS
Room temperature Tensile strength kgf/㎟ ≥ 30 ≥ 40
Elongation % > 6 > 8
High temperature Tensile strength kgf/㎟ ≥ 25 ≥ 35
Elongation % > 10 > 8
Adhesive strength ㎛ ≥ 0.7 ≥ 0.7
Corresponding surface roughness ㎛ ≤ 2.5 ≤ 2.0
Corresponding thickness ㎛ 12, 18 7, 8, 9, 12
IUT / UTL / UTS / UTZ / UTFS
Product Features

Material suitable for PKG Substrate applications in Memory, RF, and mobile DEP, characterized by low surface roughness and stable peel strength even at high temperatures. Ultra-thin copper foil with a thickness of less than 5 micrometers, ideal for creating fine patterns, comes with an attached carrier. The product is graded based on surface roughness.

Surface profile Rz ≤ 1.5, low surface profile
Adhesive strength R/S 3~30, @ 220~240℃
Thickness 1 ~ 5㎛
Property table
Classification IUT UTL UTS UTZ UTFS
Corresponding surface roughness kgf/㎟ ≤ 1.50 ≤ 1.30 ≤ 1.00 ≤ 0.70 ≤ 1.00
Peeling strength gf/㎝ 3~30 3~30 3~30 3~30 3~30
Adhesive strength @BT kgf/㎝ ≥ 0.5 ≥ 0.5 ≥ 0.5 ≥ 0.5 ≥ 0.5
Corresponding thickness ㎛ 1, 1.5, 2, 3, 5 1, 1.5, 2, 3, 5 1, 1.5, 2, 3 1, 1.5, 2, 3 3, 5
ICS
Product Features

High-quality PCB foil optimized for general Multilayer Rigid PCBs

Adhesive strength Stable adhesion strength to various boards
Etching Stable circuit etching properties that enable various line widths to be implemented
Thickness 8 ~ 35㎛
Property table *12㎛ standard tensile strength & elongation
Classification ICS
Room temperature Tensile strength kgf/㎟ ≥ 35
Elongation % > 3
Adhesive strength @FR-4 kgf/㎝ ≥ 0.8
Corresponding surface roughness ㎛ ≤ 4.0
Corresponding thickness ㎛ 8, 9, 12, 18, 35
IHT / ICR / IRT
Property table

Copper foil designed for superior adhesion to PI, offering excellent bending resistance without compromising on low surface roughness for flexible PCB applications

MIT Stable bending resistance can be secured
High heat resistance Copper foil that does not deform even at high processing temperatures
Thickness 7 ~ 35㎛
Property table *12㎛ standard tensile strength & elongation

Please swipe the screen left or right to check.

Classification IHT ICR IRT
Room temperature Tensile strength kgf/㎟ ≥ 25 ≥ 35 ≥ 40
Elongation % > 6 > 3 > 3
Corresponding surface roughness ㎛ ≤ 2.0 ≤ 2.5 ≤ 2.0
Corresponding thickness ㎛ 7~12 7~70 7~70
HRT / MRT / SRT
Property table

RTF(Reverse Treated Foil) product with excellent high-frequency properties up to ~10Ghz, featuring high adhesive strength with low-dielectric materials

Surface profile Rz ≤ 1.8, low surface profile
Adhesive strength P/S >0.5, @18㎛
Thickness 12 ~ 70㎛
Property table *18㎛ standard tensile strength & elongation

Please swipe the screen left or right to check.

Classification HRT MRT SRT
Grade RTF 1 RTF 2 RTF 3
Room temperature Tensile strength kgf/㎟ ≥ 35 ≥ 35 ≥ 35
Elongation % > 3 > 3 > 3
Corresponding surface roughness ㎛ ≤ 1.8 ≤ 1.5 ≤ 1.5
Corresponding thickness ㎛ 7~70
IVP / ISP / LHZ / LSZ / New Product
Property table

This product is designed for high-speed signal transmission in ultra-low light conditions, exhibiting low transmission loss in high-frequency environments. It is suitable for use as an inner layer in high-performance products such as servers, routers, and switches. It features stable adhesion characteristics with low Dk, Df resins and has low loss properties. The ultra-low roughness surface treatment with Rz 0.5 or less ensures excellent performance even in frequency bands up to 50GHz. HVLP provides stable adhesion between the resin and Elecfoil, and the ultra-fine nodule treatment maximizes ultra-high-speed signal transmission characteristics. Thanks to these features, HVLP copper foil has established itself as an essential material for high-speed signal transmission in applications such as 6G and AI.

Surface profile Low surface profile and fine nodule size
Adhesive strength P/S >0.4, @18㎛
Thickness 12 ~ 35㎛
Property table *18㎛ standard tensile strength & elongation

Please swipe the screen left or right to check.

Classification IVP ISP LHZ LSZ New
Product
Grade HVLP 1 HVLP 2 HVLP 3 HVLP 4 HVLP 5
Room temperature Tensile strength kgf/㎟ ≥ 45 ≥ 45 ≥ 35 ≥ 35 Under development
Elongation % > 3 > 3 > 3 > 3
Corresponding surface roughness ㎛ ≤ 1.5 ≤ 1.2 ≤ 1.0 ≤ 0.8 ≤ 0.5
Corresponding thickness ㎛ 12~35
LPF / LPS
Property table

High-performance copper foil with exceptional mechanical strength, facilitating the creation of Fine Pattern during circuit etching, making it an ideal material for Package Substrates. Maintains high adhesive strength despite low surface roughness, suitable for use in HDI(High Density Interconnection) applications.
The product is differentiated by high-temperature elongation rate.

Surface profile Rz ≤ 2.0, low surface profile
Adhesive strength P/S >0.7, @12㎛
Thickness 7 ~ 12㎛
Property table *12㎛ standard Tensile strength & Elongation
Classification LPF LPS
Room temperature Tensile strength kgf/㎟ ≥ 30 ≥ 40
Elongation % > 6 > 8
High temperature Tensile strength kgf/㎟ ≥ 25 ≥ 35
Elongation % > 10 > 8
Adhesive strength ㎛ ≥ 0.7 ≥ 0.7
Corresponding surface roughness ㎛ ≤ 2.5 ≤ 2.0
Corresponding thickness ㎛ 12, 18 7, 8, 9, 12
IUT / UTL / UTS / UTZ / UTFS
Property table

Material suitable for PKG Substrate applications in Memory, RF, and mobile DEP, characterized by low surface roughness and stable peel strength even at high temperatures. Ultra-thin copper foil with a thickness of less than 5 micrometers, ideal for creating fine patterns, comes with an attached carrier. The product is graded based on surface roughness.

Surface profile Rz ≤ 1.5, low surface profile
Adhesive strength R/S 3~30, @ 220~240℃
Thickness 1 ~ 5㎛
Property table *18㎛ standard Tensile strength & Elongation

Please swipe the screen left or right to check.

Classification IUT UTL UTS UTZ UTFS
Corresponding surface roughness kgf/㎟ ≤ 1.50 ≤ 1.30 ≤ 1.00 ≤ 0.70 ≤ 1.00
Peeling strength gf/㎝ 3~30 3~30 3~30 3~30 3~30
Adhesive strength @BT kgf/㎝ ≥ 0.5 ≥ 0.5 ≥ 0.5 ≥ 0.5 ≥ 0.5
Corresponding thickness ㎛ 1, 1.5, 2, 3, 5 1, 1.5, 2, 3, 5 1, 1.5, 2, 3 1, 1.5, 2, 3 3, 5