High-quality PCB foil optimized for general Multilayer Rigid PCB
Classification | ICS | ||
---|---|---|---|
Room temperature | Tensile strength | kgf/㎟ | ≥ 35 |
Elongation | % | > 3 | |
Adhesive strength | @FR-4 | kgf/㎝ | ≥ 0.8 |
Corresponding surface roughness | ㎛ | ≤ 4.0 | |
Corresponding thickness | ㎛ | 8, 9, 12, 18, 35 |
Elecfoil designed for superior adhesion to PI, offering excellent bending resistance without compromising on low surface roughness for flexible PCB applications
Classification | IHT | ICR | IRT | ||
---|---|---|---|---|---|
Room temperature | Tensile strength | kgf/㎟ | ≥ 25 | ≥ 35 | ≥ 40 |
Elongation | % | > 6 | > 3 | > 3 | |
Corresponding surface roughness | ㎛ | ≤ 2.0 | ≤ 2.5 | ≤ 2.0 | |
Corresponding thickness | ㎛ | 7~12 | 7~70 | 7~70 |
RTF(Reverse Treated Foil) product with excellent high-frequency properties up to ~10Ghz, featuring high adhesive strength with low-dielectric materials
Classification | HRT | MRT | SRT | ||
---|---|---|---|---|---|
Grade | RTF 1 | RTF 2 | RTF 3 | ||
Room temperature | Tensile strength | kgf/㎟ | ≥ 35 | ≥ 35 | ≥ 35 |
Elongation | % | > 3 | > 3 | > 3 | |
Corresponding surface roughness | ㎛ | ≤ 1.8 | ≤ 1.5 | ≤ 1.5 | |
Corresponding thickness | ㎛ | 7~70 |
Elecfoil engineered for low-loss, high-speed signal transmission, demonstrating exceptional performance at frequencies up to ~50GHz, making it suitable for the inner layers of High-End servers, routers, and switches.
Elecfoil designed for high-speed data transfer, featuring reliable adhesive strength and low-loss properties when paired with Dk and DF resin materials. Ideal for use in 5G antennas, autonomous vehicles, and data centres, and is categorized into different grades based on its surface roughness to meet diverse application requirements.
Classification | IVP | ISP | LHZ | LSZ |
New Product |
||
---|---|---|---|---|---|---|---|
Grade | HVLP 1 | HVLP 2 | HVLP 3 | HVLP 4 | HVLP 5 | ||
Room temperature | Tensile strength | kgf/㎟ | ≥ 45 | ≥ 45 | ≥ 35 | ≥ 35 | Under development |
Elongation | % | > 3 | > 3 | > 3 | > 3 | ||
Corresponding surface roughness | ㎛ | ≤ 1.5 | ≤ 1.2 | ≤ 1.0 | ≤ 0.8 | ≤ 0.5 | |
Corresponding thickness | ㎛ | 12~35 |
High-performance Elecfoil with exceptional mechanical strength, facilitating the creation of Fine Pattern during circuit etching, making it an ideal material for Package Substrates. Maintains high adhesive strength despite low surface roughness, suitable for use in HDI(High Density Interconnection) applications.
The product is differentiated by high-temperature elongation rate.
Classification | LPF | LPS | ||
---|---|---|---|---|
Room temperature | Tensile strength | kgf/㎟ | ≥ 30 | ≥ 40 |
Elongation | % | > 6 | > 8 | |
High temperature | Tensile strength | kgf/㎟ | ≥ 25 | ≥ 35 |
Elongation | % | > 10 | > 8 | |
Adhesive strength | ㎛ | ≥ 0.7 | ≥ 0.7 | |
Corresponding surface roughness | ㎛ | ≤ 2.5 | ≤ 2.0 | |
Corresponding thickness | ㎛ | 12, 18 | 7, 8, 9, 12 |
Material suitable for PKG Substrate applications in Memory, RF, and mobile DEP, characterized by low surface roughness and stable peel strength even at high temperatures. Ultra-thin Elecfoil with a thickness of less than 5 micrometers, ideal for creating fine patterns, comes with an attached carrier. The product is graded based on surface roughness.
Classification | IUT | UTL | UTS | UTZ | UTFS | ||
---|---|---|---|---|---|---|---|
Corresponding surface roughness | kgf/㎟ | ≤ 1.50 | ≤ 1.30 | ≤ 1.00 | ≤ 0.70 | ≤ 1.00 | |
Peeling strength | gf/㎝ | 3~30 | 3~30 | 3~30 | 3~30 | 3~30 | |
Adhesive strength | @BT | kgf/㎝ | ≥ 0.5 | ≥ 0.5 | ≥ 0.5 | ≥ 0.5 | ≥ 0.5 |
Corresponding thickness | ㎛ | 1, 1.5, 2, 3, 5 | 1, 1.5, 2, 3, 5 | 1, 1.5, 2, 3 | 1, 1.5, 2, 3 | 3, 5 |
High-quality PCB foil optimized for general Multilayer Rigid PCB
Classification | ICS | ||
---|---|---|---|
Room temperature | Tensile strength | kgf/㎟ | ≥ 35 |
Elongation | % | > 3 | |
Adhesive strength | @FR-4 | kgf/㎝ | ≥ 0.8 |
Corresponding surface roughness | ㎛ | ≤ 4.0 | |
Corresponding thickness | ㎛ | 8, 9, 12, 18, 35 |
Elecfoil designed for superior adhesion to PI, offering excellent bending resistance without compromising on low surface roughness for flexible PCB applications
Please swipe the screen left or right to check.
Classification | IHT | ICR | IRT | ||
---|---|---|---|---|---|
Room temperature | Tensile strength | kgf/㎟ | ≥ 25 | ≥ 35 | ≥ 40 |
Elongation | % | > 6 | > 3 | > 3 | |
Corresponding surface roughness | ㎛ | ≤ 2.0 | ≤ 2.5 | ≤ 2.0 | |
Corresponding thickness | ㎛ | 7~12 | 7~70 | 7~70 |
RTF(Reverse Treated Foil) product with excellent high-frequency properties up to ~10Ghz, featuring high adhesive strength with low-dielectric materials
Please swipe the screen left or right to check.
Classification | HRT | MRT | SRT | ||
---|---|---|---|---|---|
Grade | RTF 1 | RTF 2 | RTF 3 | ||
Room temperature | Tensile strength | kgf/㎟ | ≥ 35 | ≥ 35 | ≥ 35 |
Elongation | % | > 3 | > 3 | > 3 | |
Corresponding surface roughness | ㎛ | ≤ 1.8 | ≤ 1.5 | ≤ 1.5 | |
Corresponding thickness | ㎛ | 7~70 |
Elecfoil engineered for low-loss, high-speed signal transmission, demonstrating exceptional performance at frequencies up to ~50GHz, making it suitable for the inner layers of High-End servers, routers, and switches.
Elecfoil designed for high-speed data transfer, featuring reliable adhesive strength and low-loss properties when paired with Dk and DF resin materials. Ideal for use in 5G antennas, autonomous vehicles, and data centres, and is categorized into different grades based on its surface roughness to meet diverse application requirements.
Please swipe the screen left or right to check.
Classification | IVP | ISP | LHZ | LSZ |
New Product |
||
---|---|---|---|---|---|---|---|
Grade | HVLP 1 | HVLP 2 | HVLP 3 | HVLP 4 | HVLP 5 | ||
Room temperature | Tensile strength | kgf/㎟ | ≥ 45 | ≥ 45 | ≥ 35 | ≥ 35 | Under development |
Elongation | % | > 3 | > 3 | > 3 | > 3 | ||
Corresponding surface roughness | ㎛ | ≤ 1.5 | ≤ 1.2 | ≤ 1.0 | ≤ 0.8 | ≤ 0.5 | |
Corresponding thickness | ㎛ | 12~35 |
High-performance Elecfoil with exceptional mechanical strength, facilitating the creation of Fine Pattern during circuit etching, making it an ideal material for Package Substrates. Maintains high adhesive strength despite low surface roughness, suitable for use in HDI(High Density Interconnection) applications.
The product is differentiated by high-temperature elongation rate.
Classification | LPF | LPS | ||
---|---|---|---|---|
Room temperature | Tensile strength | kgf/㎟ | ≥ 30 | ≥ 40 |
Elongation | % | > 6 | > 8 | |
High temperature | Tensile strength | kgf/㎟ | ≥ 25 | ≥ 35 |
Elongation | % | > 10 | > 8 | |
Adhesive strength | ㎛ | ≥ 0.7 | ≥ 0.7 | |
Corresponding surface roughness | ㎛ | ≤ 2.5 | ≤ 2.0 | |
Corresponding thickness | ㎛ | 12, 18 | 7, 8, 9, 12 |
Material suitable for PKG Substrate applications in Memory, RF, and mobile DEP, characterized by low surface roughness and stable peel strength even at high temperatures. Ultra-thin Elecfoil with a thickness of less than 5 micrometers, ideal for creating fine patterns, comes with an attached carrier. The product is graded based on surface roughness.
Please swipe the screen left or right to check.
Classification | IUT | UTL | UTS | UTZ | UTFS | ||
---|---|---|---|---|---|---|---|
Corresponding surface roughness | kgf/㎟ | ≤ 1.50 | ≤ 1.30 | ≤ 1.00 | ≤ 0.70 | ≤ 1.00 | |
Peeling strength | gf/㎝ | 3~30 | 3~30 | 3~30 | 3~30 | 3~30 | |
Adhesive strength | @BT | kgf/㎝ | ≥ 0.5 | ≥ 0.5 | ≥ 0.5 | ≥ 0.5 | ≥ 0.5 |
Corresponding thickness | ㎛ | 1, 1.5, 2, 3, 5 | 1, 1.5, 2, 3, 5 | 1, 1.5, 2, 3 | 1, 1.5, 2, 3 | 3, 5 |